WBG Turnkey
WBG Manual Turnkey
- Model MF-PE2000 is for 8″ wafers.
- Model MF-PE3000 is for 12″ wafers.
WBG Auto Turnkey
- Model SF-DS8 is for 8” wafer chip sorting.
- Model SF-DS12 is for 12” wafer chip sorting.
RF Turnkey
RF Turnkey
- Software infrastructure
- PXI Products for RF Solution
- PXI RF Total Solution
- VCSEL(for R&D)
▏Software infrastructure
▏PXI Products for RF Solution
PXI-Based instrumentation is that are
- Flexible
- Scalable
- Re-configurable
Test Sockets
- High Speed up to 20Ghz
- BGA, LGA, CSP, QFN, TQFP
- Pitch down to .2mm
- ATE, SLT, Production Test
- Floating Guide available
- -50 to 150 c
Probe Card Design
- Frequency up to 40GHz
- WLCSP, Bumping, Gold or Aluminum pad
- Min. pitch 50um
- Single, dual and quad site
- ATE Production Test
- Temp. -50 to 150 degree
Pure Digital Tester
- For RF MIPI
- MIPI Speed 56MHz
- Quad site true parallel test
- With UF2000 to MP
- Cable mount (Soft docking)
- Wafer map, binning, auto upload raw to server……
Filter Tester
- Frequency up to 26GHz
- Full auto calibration (ISS)
- Dual or quad site true parallel test
- Cable mount (Soft docking)
- Wafer map, binning, auto upload raw data server
SAW Filter Tester
- Frequency up to 6GHz
- Full auto calibration (ISS)
- Dual or quad site true parallel test
- Direct mount (Hard docking)
- Wafer map, binning, auto upload raw data server
▏VCSEL(for R&D)
IFSM Turnkey
IFSM Turnkey
The IFSM 3000A Diode Surge Current Tester provides a test for diode surge current, up to 3000A surge current under 10μs pulse width, and another 100μs and 1ms pulse width, a total of three modes can be selected.
Flex T&M Measurement and Analysis Software
Panel Automation Measurement Analysis
Inline Automatic Testing Program
• For inline automatic process TEG testing run
• Inline automatic measurement process recipe setup
• Testing item : FPD TFT IV (IdVg/IdVd), CV, Kelvin testing (R4T)…etc.
• Measurement report save as .csv file
• Prober communication
Instrument Controllable
• Keithley 6430, 2400, 2450…etc
• Keysight B1500A, E5270B, E4980A…etc
Wafer-Level Metrology Analysis
FlexTM version 1.6 is the latest measurement software of POMME
Its functions cover measurement requirements such as FPD, RDL & 4PP
With fast parameter setting and easy use
Can effectively shorten the total time required for measurement.
Flex-T&M Auto Mode for RDL Testing
• For inline automatic process RDL testing run
• Testing item include : Wafer Bumping Leakage & Res
• Measurement report save as .csv file
• Prober communication
Flex-T&M Manual Mode
• For device characteristic quick check
• Inline automatic measurement process recipe setup (Option)
• Measurement report save as .csv file
• Testing item include:
• Wafer Bumping Leakage & Res,
• FPD TFT IV (IdVg/IdVd),
• CV,
• Kelvin testing(R4T)…etc.
Flex-T&M for 4PP SemiAuto Testing
• For Semi-Auto prober 4 point probe (4PP) sheet resistivity testing
• Wafer map quick create
• TCR measurement
• 2D/3D map shows for full wafer testing results
• Measurement report save as .csv file
• Prober communication
Instrument Controllable
• Keithley 6430, 2400, 2600, 2182…etc
• Keysight B1500A, E5270B, 3458A, E4980A…etc
Contact Us
POMME TECHNOLOGIES CO,. LTD
PHONE:+886-3-5506360
TEX:+886-3-6582871
E-mail:sales@pommefr.com
新竹縣竹北市興隆路二段341號17樓
17F., No.341, Sec. 2, Xinglong Rd., Zhubei City, Hsinchu County 302050, Taiwan (R.O.C.)
© Copyright – POMME TECHNOLOGIES
– design by Morcept