整合方案 - 禧恩科技 POMME TECHNOLOGIES

▎整合方案

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WBG Turnkey 解決方案

WBG Manual Turnkey

Model MF-PE2000 is for 8″ wafers.
Model MF-PE3000 is for 12″ wafers.

WBG Auto Turnkey

Model SF-DS8 is for 8” wafer chip sorting.
Model SF-DS12 is for 12” wafer chip sorting.

RF Turnkey 解決方案

RF Turnkey解決方案

Software infrastructure
PXI Products for RF Solution
PXI RF Total Solution
VCSEL(for R&D)

▏Software infrastructure

▏PXI Products for RF Solution

PXI-Based instrumentation is that are

Flexible
Scalable
Re-configurable

Test Sockets

High Speed up to 20Ghz
BGA, LGA, CSP, QFN, TQFP
Pitch down to .2mm
ATE, SLT, Production Test
Floating Guide available
-50 to 150 c

Probe Card Design

Frequency up to 40GHz
WLCSP, Bumping, Gold or Aluminum pad
Min. pitch 50um
Single, dual and quad site
ATE Production Test
Temp. -50 to 150 degree

Pure Digital Tester

For RF MIPI
MIPI Speed 56MHz
Quad site true parallel test
With UF2000 to MP
Cable mount (Soft docking)
Wafer map, binning, auto upload raw to server……

Filter Tester

Frequency up to 26GHz
Full auto calibration (ISS)
Dual or quad site true parallel test
Cable mount (Soft docking)
Wafer map, binning, auto upload raw data server

SAW Filter Tester

Frequency up to 6GHz
Full auto calibration (ISS)
Dual or quad site true parallel test
Direct mount (Hard docking)
Wafer map, binning, auto upload raw data server

▏VCSEL(for R&D)

IFSM Turnkey 解決方案

IFSM Turnkey

IFSM 3000A 二極體突波電流測試機提供了針對二極體對於突波電流的測試，在 10μs 的脈波寬度(Pulse Width)下高達 3000A 的突波電流(Surge Current)，且另有 100μs 和 1ms 的脈波寬度，總共三種模式可選擇。IFSM 3000A 亦提供曲線繪製功能，能夠在實際測試與驗證規範之中取得更好的平衡，以滿足您的量測需求。

Flex T&M 量測分析軟體

面板自動化量測分析

Inline Automatic Testing Program

• For inline automatic process TEG testing run
• Inline automatic measurement process recipe setup
• Testing item : FPD TFT IV (IdVg/IdVd), CV, Kelvin testing (R4T)…etc.
• Measurement report save as .csv file
• Prober communication

Instrument Controllable

• Keithley 6430, 2400, 2450…etc
• Keysight B1500A, E5270B, E4980A…etc

Date

1 2 3

晶圓級量測分析

FlexTM 1.6 版本為目前禧恩最新的量測軟體
其功能涵蓋FPD, RDL & 4PP等量測需求
擁有快速的參數設定和簡易的使用方式
能夠有效縮短量測所需的總耗時

Flex-T&M Auto Mode for RDL Testing
• For inline automatic process RDL testing run
• Testing item include : Wafer Bumping Leakage & Res
• Measurement report save as .csv file
• Prober communication

Flex-T&M Manual Mode
• For device characteristic quick check
• Inline automatic measurement process recipe setup (Option)
• Measurement report save as .csv file
• Testing item include:
• Wafer Bumping Leakage & Res,
• FPD TFT IV (IdVg/IdVd),
• CV,
• Kelvin testing(R4T)…etc.